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sanken electric co., ltd. description lc5550ld series are pwm and quasi-resonant topology non-isolated buck led driver ics. they incorporate sepa- rate controller and power mosfet chips, and are designed for input capacitorless applications. the controller adapts the average current control method for realizing high power factors. the rich set of protection features helps to realize low component counts, and high performance-to-cost power supply. features and benefits pwm and quasi-resonant topology integrated on-time control circuit (it realizes high power factor by average current control) integrated soft-start circuit (reduces power stress during start-up on the incorporated power mosfet and output rectifier) integrated bias assist circuit (improves startup performance, suppresses v cc voltage droop during operation, and allows use of low-rated ceramic capacitor on vcc pin) integrated leading edge blanking (leb) circuit integrated maximum on-time limit circuit protection features: ? overcurrent protection (ocp): pulse-by-pulse ? overvoltage protection (ovp): latched shutdown ? overload protection (olp): latched shutdown ? thermal shutdown (tsd): latched shutdown single-stage power factor corrected high efficiency non-isolated buck led driver typical application package: 8-pin dip not to scale lc5550ld series lc5550ld-ds july 9, 2012 d1 d2 d3 d4 c1 c3 c4 c 5 d 5 r 2 r 3 r 4 c 2 c 6 c7 r 1 d 6 led t1 r5 d/st isense nf ocp/bd s/gnd comp u1 8 6 5 4 3 2 1 contro1 v ac v cc lc5550ld r6 applications led lighting fixtures led light bulbs downloaded from: http:///
2 sanken electric co., ltd. lc5550ld-ds single-stage power factor corrected high efficiency non-isolated buck led driver lc5550ldseries july 9, 2012 selection guide part number mosfet v dss (min) (v) r ds(on) (max) ( ) pwm operation frequency, f osc (typ) (khz) on-time t on(max) (typ) ( s) lc5555ld 650 3.95 72 9.3 LC5556LD 650 1.9 60 11.2 *based on the thermal rating; the allowable maximum output power can be up to 120% to 140% of this value. however, maximum output power may be limited in such an application with low output voltage or short duty cycle. the polarity value for current specifies a sink as "+," and a source as ? , referencing the ic. lc5550ld absolute maximum ratings unless specifically noted, t a is 25c characteristic symbol notes pins rating unit drain current 1 i dpeak lc5555ld single pulse 8 C 1 2.5 a LC5556LD single pulse 8 C 1 4.0 a single pulse avalanche energy 2 e as lc5555ld i lpeak = 2.0 a, v dd = 99 v, l = 20 mh 8 C 1 47 mj LC5556LD i lpeak = 2.7 a, v dd = 99 v, l = 20 mh 8 C 1 86 mj input voltage for control part (mic) v cc 2 C 1 35 v ocp/bd pin voltage v ocp 3 C 1 ? 2.0 to 5.0 v comp pin voltage v comp 4 C 1 ? 0.3 to 7.0 v isense pin voltage v sen 6 C 1 ? 0.3 to 5.0 v allowable power dissipation of mosfet 3 p d1 mounted on a 15 mm 15 mm pcb 8 C 1 0.97 w operating ambient temperature t op D? 55 to 125 c storage temperature t stg D? 55 to 125 c channel temperature t ch D 150 c 1 refer to mosfet safe operating area curve. 2 refer to mosfet avalanche energy derating coefficient curve. 3 refer to mosfet temperature versus power dissipation curve. downloaded from: http:///
3 sanken electric co., ltd. lc5550ld-ds single-stage power factor corrected high efficiency non-isolated buck led driver lc5550ldseries july 9, 2012 lc5550ld electrical characteristics of control part (mic) unless specifically noted, t a is 25c, v cc is 18 v characteristic symbol test conditions pins min. typ. max. unit power supply startup operation operation start voltage v cc(on) 2 C 1 13.8 15.1 17.3 v operation stop voltage* v cc(off) 2 C 1 8.4 9.4 10.7 v circuit current in operation i cc(on) 2 C 1 C C 4.7 ma startup circuit operation voltage v startup 8 C 1 18 21 24 v startup current i cc(startup) v cc = 13 v 2 C 1 ? 8.5 ? 4.0 ? 1.5 ma startup current threshold biasing voltage* v cc(bias) 2 C 1 9.5 11.0 12.5 v normal operation pwm operation frequency f osc lc5555ld 8 C 1 60 72 84 khz LC5556LD 50 60 70 khz maximum on-time t on(max) lc5555ld 8 C 1 8.0 9.3 11.2 s LC5556LD 9.0 11.2 13.4 s comp pin control minimum voltage v comp(min) 4 C 1 0.30 0.55 0.80 v error amplifier reference voltage v sen(th) 6 C 1 C0.21 C0.2 C0.19 v error amplifier source current i sen(source) 4 C 1 ? 36 ? 24 ? 12 a error amplifier sink current i sen(sink) 4 C 1 12 24 36 a leading edge blanking time t on(leb) 3 C 1 ? 600 ? ns quasi-resonant operation threshold voltage-1 v bd(th1) 3 C 1 0.14 0.24 0.34 v quasi-resonant operation threshold voltage-2 v bd(th2) 3 C 1 0.11 0.16 0.21 v protected operationocp/bd pin overcurrent protection (ocp) threshold voltage v ocp 3 C 1 ? 0.92 ? 0.8 ? 0.68 v ocp.bd pin source current i ocp 3 C 1 ? 120 ? 40 ? 10 a ocp/bd pin overvoltage protection (ovp) operation voltage v bd(ovp) 3 C 1 2.2 2.6 3.0 v overload protection (olp) threshold voltage v comp(olp) 4 C 1 4.1 4.5 4.9 v vcc pin ovp threshold voltage v cc(ovp) 2 C 1 28.5 31.5 34.0 v thermal shutdown activating temperature t j(tsd) C 135 C C c *v cc(bias) > v cc(off) always. downloaded from: http:///
4 sanken electric co., ltd. lc5550ld-ds single-stage power factor corrected high efficiency non-isolated buck led driver lc5550ldseries july 9, 2012 lc5550ld electrical characteristics of mosfet unless specifically noted, t a is 25c characteristic symbol test conditions pins min. typ. max. unit drain-to-source breakdown voltage v dss 8 C 1 650 DD v drain leakage current i dss 8 C 1 DD 300 a on-resistance r ds(on) lc5555ld 8 C 1 DD 3.95 LC5556LD DD 1.9 switching time t f lc5555ld 8 C 1 DD 250 ns LC5556LD DD 400 ns thermal resistance* r ch-c lc5555ld D DD 42 c/w LC5556LD DD 35.5 c/w *the thermal resistance between the channels of the mosfet and the case. t c measured at the center of the case marked side. downloaded from: http:///
5 sanken electric co., ltd. lc5550ld-ds single-stage power factor corrected high efficiency non-isolated buck led driver lc5550ldseries july 9, 2012 10 1 0.1 0.01 transient thermal resistance, r ch-c (c/w) transient thermal resistance curve time (s) 10 C6 10 C5 10 C4 10 C3 10 C2 10 C1 ambient temperature, t a (c) 1.21.0 0.8 0.6 0.4 0.2 0 0 255075 125 100 150 mosfet temperature versus power dissipation curve allowable power dissipation, p d1 (w) channel temperature, t ch (c) 100 8060 40 20 0 25 50 75 125 100 150 eas temperature derating coefficient (%) mosfet avalanche energy derating coefficient curve drain-to-source voltage, v ds (v) 10 1 0.1 0.01 1 10 100 1000 drain current, i d (a) mosfet safe operating area curve drain current limited by on-resistance 1 ms 0.1 ms to use this graph, apply the s.o.a temperature derating coefficient taken from the graph at the left channel temperature, t ch (c) 100 8060 40 20 0 safe operating area temperature derating coefficient (%) s. o. a. temperature derating coefficient curve 0 255075 125 100 150 characteristic performance lc5555ld downloaded from: http:///
6 sanken electric co., ltd. lc5550ld-ds single-stage power factor corrected high efficiency non-isolated buck led driver lc5550ldseries july 9, 2012 10 1 0.1 0.01 transient thermal resistance, r ch-c (c/w) transient thermal resistance curve time (s) 10 C6 10 C5 10 C4 10 C3 10 C2 10 C1 ambient temperature, t a (c) 1.21.0 0.8 0.6 0.4 0.2 0 0 255075 125 100 150 mosfet temperature versus power dissipation curve allowable power dissipation, p d1 (w) channel temperature, t ch (c) 100 8060 40 20 0 25 50 75 125 100 150 eas temperature derating coefficient (%) mosfet avalanche energy derating coefficient curve drain-to-source voltage, v ds (v) 10 1 0.1 0.01 1 10 100 1000 drain current, i d (a) mosfet safe operating area curve drain current limited by on-resistance 1 ms 0.1 ms to use this graph, apply the s.o.a temperature derating coefficient taken from the graph at the left 100 8060 40 20 0 safe operating area temperature derating coefficient (%) s. o. a. temperature derating coefficient curve channel temperature, t ch (c) 0 255075 125 100 150 characteristic performance LC5556LD downloaded from: http:///
7 sanken electric co., ltd. lc5550ld-ds single-stage power factor corrected high efficiency non-isolated buck led driver lc5550ldseries july 9, 2012 d1 d2 d3 d4 c1 c3 c4 c 5 d 5 r 2 r 3 r 4 c 2 c 6 c7 r 1 d 6 led t1 r5 d/st isense nf ocp/bd s/gnd comp u1 8 6 5 4 3 2 1 contro1 v ac v cc lc5550ld r6 d1 d2 d3 d4 c1 c v c3 c4 c 5 d 5 r 2 r 3 r 4 c 2 c 6 c 6 c7 r 1 d 6 d 7 d 8 led t1 r5 d/st isense nf ocp/bd s/gnd comp u1 8 6 5 4 3 2 1 contro1 v ac v cc r 7 lc5550ld r6 typical application circuit 1, pwm topology typical application circuit 2, quasi-resonant topology downloaded from: http:///
8 sanken electric co., ltd. lc5550ld-ds single-stage power factor corrected high efficiency non-isolated buck led driver lc5550ldseries july 9, 2012 functional block diagram s/gnd tsd leb d/st start up reg bias uvlo vcc ocp/bd ovp osc ocp detection bottom reg control feedback olp drv comp nf isense q s r ota control part reg pin list table number name function 1 s/gnd mosfet source and gnd pin for the control part 2 vcc supply voltage input and overvoltage protection (ovp) signal input 3 ocp/bd overcurrent protection (ocp), quasi-resonant signal input, and overvoltage protection (ovp) signal input 4 comp feedback phase-compensation input 5n f no function; must be externally connected to s/gnd pin with as short a trace as possible, for stable operation of the ic 6 isense output current sensing voltage input 7 C pin removed 8 d/st mosfet drain pin and input of the startup current 12 3 4 8 65 d/st isense nf s/gnd vcc ocp/bd comp pin-out diagram downloaded from: http:///
9 sanken electric co., ltd. lc5550ld-ds single-stage power factor corrected high efficiency non-isolated buck led driver lc5550ldseries july 9, 2012 package diagramdip8 package 0 . 2 5 + 0 . 1 - 0 . 0 5 6.5 1 4 5 8 9.4 0.3 0.5 0.1 0.89 typ 4.2 0.3 3.3 3.4 0.1 0.2 (7.6 typ) 2.54 typ -0.05 -0.05 0.2 0.5 7.5 +0.3 +0.3 1.0 1.52 unit mm part numberlot number sanken control number lc555 x sk ymd l y is the last digit of the year (0 to 9)m is the month (1 to 9, o, n, or d) d is a period of days (1 to 3): 1 C 1 st to 10 th 2 C 11 th to 20 th 3 C 21 st to 31 st 81 pb-free. device composition compliant with the rohs directive. downloaded from: http:///
10 sanken electric co., ltd. lc5550ld-ds single-stage power factor corrected high efficiency non-isolated buck led driver lc5550ldseries july 9, 2012 because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. cautions for storage ensure that storage conditions comply with the standard temperature (5c to 35c) and the standard relative humidity (around 40% to 75%); avoid storage locations that experience extreme changes in temperature or humidity. avoid locations where dust or harmful gases are present and avoid direct sunlight. reinspect for rust on leads and solderability of the products that have been stored for a long time. cautions for testing and handling when tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. ensure all test parameters are within the ratings specified by sanken for the products. remarks about using silicone grease with a heatsink when silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. if more silicone grease than required is applied, it may produce excess stress. volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink. our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: type suppliers g746 shin-etsu chemical co., ltd. yg6260 momentive performance materials inc. sc102 dow corning toray co., ltd. soldering when soldering the products, please be sure to minimize the working time, within the following limits: 2605c 101 s (flow, 2 times) 38010c 3.50.5 s (soldering iron, 1 time) soldering should be at a distance of at least 1.5 mm from the body of the products. electrostatic discharge when handling the products, the operator must be grounded. grounded wrist straps worn should have at least 1 m of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. when using measuring equipment such as a curve tracer, the equipment should be grounded. when soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. the products should always be stored and transported in sanken shipping containers or conductive containers, or be wrapped in aluminum foil. downloaded from: http:///
11 sanken electric co., ltd. lc5550ld-ds single-stage power factor corrected high efficiency non-isolated buck led driver lc5550ldseries july 9, 2012 the contents in this document are subject to changes, for improvement and other purposes, without notice. make sure that this is the latest revision of the document before use. application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod- ucts herein and sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of sanken or any third party which may result from its use. although sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon- ductor products at a certain rate is inevitable. users of sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip- ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). when considering the use of sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. in the case that you use sanken products or design your products by using sanken products, the reliability largely depends on the degree of derating to be made to the rated values. derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. in general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. for these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. in addition, it should be noted that since power devices or ic's including power devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly. when using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. anti radioactive ray design is not considered for the products listed herein. sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of sanken's distribu- tion network. the contents in this document must not be transcribed or copied without sanken's written consent. downloaded from: http:///

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